➀ Infineon Technologies has unveiled the next generation of high-density power modules to enhance AI and HPC capabilities.

➁ The OptiMOS TDM2454xx modules offer industry-leading power density and efficiency, optimizing the total cost of ownership for AI data center operators.

➂ These modules feature vertical power delivery (VPD) to reduce resistive losses and improve performance, building upon the success of previous dual-phase modules.

➀ The power module packaging materials market is expected to reach nearly $6.1 billion by 2030, with a CAGR of nearly 11% between 2024 and 2030;

➁ Packaging materials costs accounted for approximately 32% of the total cost of power modules in 2024;

➂ The market is being reshaped with new entrants, M&As, and strategic shifts.